The Source for Active Solder Alloys

Bonding without fluxes or plating

Reducing bond contamination risks during brazing and soldering and eliminating the need for plating on metals typically used in metal to metal bonding and aluminum brazing. See how S-Bond Technology works.

Bonding of Ceramic to Metal

Ceramic metal bonding for joints that are hermetic and thermally conductive. Can be used to solder ceramics and is used in carbon bonding, and sapphire bonding. Active soldering in many applications can replace ceramic brazing. More information on Ceramic Bonding >>

 

Aluminum Joining

Aluminum bonding in one simple, flux free step and can replace aluminum brazing in many applications. Active solders eliminates the need to plate before soldering and aggressive chemical fluxes are not required thus post bond cleaning is not required.

Vacuum Brazing

Offering a range of vacuum brazing and bonding services, expanding our range of bonding services to our customers over and above our soldering services.

Thermal Management Components

Offering S-Bond solutions for bonding thermal pyrolytic graphite / graphene / graphite foams and other metals to fabricate innovative thermal management components

Low temperature bonding

Protecting sensitive assembly components… joing a range of materials with active solderis with melting temperatures ranging from 115 – 450˚C. Bonding services are provided that take advantage of all the attributes of active soldering such as aluminum bonding and ceramic metal bonding. For more information on active solder processing >>

 

Dissimilar Materials Joining

Brazing and soldering of dissimilar materials needs to accomodate differences in materials chemistry and thermal expansion properties of the materials being joined. Lower temperature metal bonding using S-Bond active solders, lowers thermal expansion mismatch stresses and the active elements in S-Bond solders permit these solders to wet and adhere to many base materials. For more information on dissimilar materials bonding >>

 

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News & Highlights

LED Headlamp Cooling Enabled by Thermal Pyrolytic Graphite (TPG*) Materials via S-Bond Joining By          Dr. Ronald Smith, S-Bond Technologies Dr. Wei Fan, Momentive Performance Materials Inc. Automotive LED headlights present a thermal management challenge where conventional aluminum- and copper-based ...
Carbon/graphite compressor seal rings are employed in many compressors and more and more metal backed graphite seals are being used in higher efficiency compressors. Frictional heating of seals can degrade metal backed graphite seals, therefore good thermal contact between the ...
Copper has superior cooling capacity than aluminum and is the preferred heat sink material for telecommunications and high power electronics. However, the weight and cost or copper limits the size of the heat sink packages. Therefore for larger electronic enclosures ...
S-Bond Technologies’ active solder joining solutions have been used by by Fermi National Accelerator Laboratory for joining carbon:carbon and pyrolytic graphite in its particle accelerator program.  The improved Forward Particle Detector (FPIX) is to be used in Compact Muon Solenoid ...