Brazing and Soldering

Aluminum Brazing - Carbon Bonding - Ceramic to Metal Brazing

S-Bond Technologies offers a wide range of bonding, brazing-soldering, and related services including:

 
Our business is metal bonding, ceramic to metal brazing, aluminum soldering and graphite bonding. Since 1996, S-Bond Technologies has helped customers solve difficult joining problems with its unique brazing-soldering products and services. 
 
Our signature bonding solution, S-Bond®, is based on  active solder technology that does not require flux, when soldering. Such solders provide a superior hermetic bond with a wide range of metallic and non-metallic materials. Our patented active solders S-Bond® products provide reliable high strength hermetic bonds between wide varieties of dissimilar materials. S-Bond products join metals, ceramics, piezo-electric ceramics, silicon and other semiconductors, glasses, and carbon materials such as diamond and graphite.
 
Our conventional flux soldering services are focused on joining structures, fittings, housings and tubing. Our experience and capabilities as a full service solder assembly shop enable us to provide make complete or turnkey assemblies.
 
Higher temperature service ( > 400C / 750F) components require the use higher temperature brazing filler metals instead of lower melting soft solders. S-Bond Technologies and its partners provide a full range of brazing services including active brazing used in the joining of ceramics to metals for high temperature use.
 
When the heating of components is not possible, S-Bond Technologies offers direct ultrasonic bonding services that utilize high frequency ( 20 - 30 KHz) ultrasonic vibration and/or shear to locally bond plastics or metals.
 
Contact Us for your metal bonding needs - ceramic to metal brazing, aluminum soldering, graphite bonding - or any other difficult joining problems; we combine our knowledge, materials and resources to assemble your components.
 
Some featured S-Bond joined components are shown below:
Metal Bonding-Active Solder Technology

Thermal Management

S-Bond joins Al- Al , Al-Cu, Cu-Cu and Al-SiC and is finding extensive application in the bonding of cold plates, vapor chambers, heat sinks and other thermal management components.  There is no flux used in joining, so post bond cleaning is not required and there is no residual flux entrapment in joints. S-Bond joins other emerging high conductivity materials such as metallic foams, graphite foams, pyrolytic graphite and diamond.  Low void bonding increases thermal conductivity and leads to improved heat sink performance.

Metal Bonding-Active Solder Technology

Solar Panel Joining

S-Bond solders have been shown to be effective in bonding metallic conductors to silicon and glass (coated and uncoated) panel surfaces, ideal for bonding conductors and heat sinks on solar panel and conductors on smart glass . Bonding employs a thermasonic technique that requires the pre-application of the S-Bond alloys onto the conductor and localized heating of panels, followed by mechanical agitation to join the silicon or glass surfaces without flux. S-Bond joining processes are in development that will enable large panels to be joined to various conductors.

Metal Bonding-Active Solder Technology

Sensors

Sensors and sensor housings require metal to metal and/or metal to ceramic bonds that make electrical connections or hermetic seals. S-Bond active solders and related processes are being used to make a wide variety of sensor components, including graphite and SiC to conductor leads for conductivity sensors, and also sapphire or quartz to titanium, Kovar® or stainless steel. These components are successfully used to make optical sensors and other sensor enclosures.

Recent News



Technical Articles



Highlights


  • Down hole drilling sensor housings are successfully using S-Bond to hermetically seal sapphire to titanium.
     
  • S-Bond process has been selected to bond graphite electrodes to signal leads for water conductivity sensors.
     
  • S-Bond joining is providing critcal bonding and sealing for high voltage insulators used in electrical power transmission capacitors and switch gear.
     
  • Joining of ceramic to metal technology being used to make SiC/ceramic x-ray mirror components to be used in semiconductor manufacture.