The Source for Active Solder Alloys

Bonding without fluxes or plating

Reducing bond contamination risks during brazing and soldering and eliminating the need for plating on metals typically used in metal to metal bonding and aluminum brazing. See how S-Bond Technology works.

Dissimilar Materials Joining

Brazing and soldering of dissimilar materials needs to accomodate differences in materials chemistry and thermal expansion properties of the materials being joined. Lower temperature metal bonding using S-Bond active solders, lowers thermal expansion mismatch stresses and the active elements in S-Bond solders permit these solders to wet and adhere to many base materials. For more information on dissimilar materials bonding >>

 

Bonding of Ceramic to Metal

Producing metallic joints that are hermetic and thermally conductive. Can be used to solder ceramics and is used in carbon bonding, and sapphire bonding. Active soldering in many applications can replace ceramic brazing. More information on Ceramic Bonding >>

 

Aluminum Joining

Aluminum bonding in one simple, flux free step and can replace aluminum brazing in many applications. Active solders eliminates the need to plate before soldering and aggressive chemical fluxes are not required thus post bond cleaning is not required.

Range of formulations

Supporting soldering hierarchy… a range of active solder filler metals provides for a range of soldering process temperatures when aluminum bonding, ceramic bonding and carbon bonding. See our Solder Alloys.

 

Low temperature bonding

Protecting sensitive assembly components… brazing-soldering of a range of materials with active soldering temperatures ranging from 115 – 450˚C. Bonding services are provided that take advantage of all the attributes of active soldering. For more information on active solder processing >>

 

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News & Highlights

While it has been several years since manufacturers began moving to lead-free solder procedures, in part due to the European Union’s Restriction of Hazardous Substances Directive, some still believe myths that have long been inaccurate regarding the use of alloy … Continue reading

S-Bond material joining applications enable engineers to use multiple materials, such as materials and ceramics, in a variety of applications. However, just because aluminum and steel can be joined, as one example, does not mean that the joining process cannot … Continue reading

Thermal interface materials are materials used in creating heat conductive paths at interfaces between components and thus reduce thermal interface resistance. These materials permit more effective heat flow between separate components where heat is being generated to a heat dissipation … Continue reading

Bond assembly can be done via 1) mechanical attachment, 2) adhesive bonding of which epoxy bonding is one form of adhesive, 3) soldering bonding using lower melting filler metals (< 450˚C), 4) brazing using filler metals melting above 450˚C and … Continue reading