Technical Resources

Technology & Applications White Papers

Your LinkS-Bond active solders bond metals, ceramics, glasses and composites.  Our alloys offer a range of bonding temperatures to maintain material properties and lower the expansion mismatch that occurs when joining dissimilar materials. The S-Bond joining process produces conductive, hermetic joints for a wide range of applications - from thermal management components to LED packaging, from sputter targets to sensor window housings. New applications are continually under development by our staff of materials professionals.  Contact us today to discuss your application. If you do not see information on the applications you have interest in, please use the More Information box to the right to send us your comments and requests.