May 18th, 2010
Hybrid S-Bond joining processes eliminate the use of fluxes and have been shown to be more effective since it completely joins with the S-Bond filler metals. The methods that are recommended to minimize the use of S-Bond, yet still achieve fluxless joining are as follows:
- Heat base materials to S-Bond melting temperature.
- Melt a small amount of S-Bond onto the joining surfaces.
- Add ~ 0.1g/cm2 to the opposing surfaces to be joined
- Add S-Bond to the opposing joint surface.
- Mechanically spread the S-Bond layer to completely cover the joint area (brush, spatula or ultrasonics).
- Melt “conventional” solders onto the S-Bond layer on the bottom base and agitate to assure wetting to the underlying S-Bond layer.
NOTE: Sn-Ag, Pb-Sn, Sn-Bi, In solders can be used
- Add enough “conventional” solder to the base to “float” and slide the top surface of the joint onto the conventional solder and provide excess solder to fill any gaps.NOTE: The sliding of the molten S-Bond / solder surfaces onto one another eliminates entrapped air and mechanically shears the surfaces of the S-Bond layer to the bottom “conventional “ solder layer on the base.
Tags: fluxless solder, soldering techniques
Posted in Technology | No Comments »
May 18th, 2010
S-Bond 220 is a solder material (Sn-Ti-Ag) and a process by which most materials, including dissimilar metallic and ceramic materials can be joined. It is a new family of solders, developed and patented by S-Bond Technologies. The material is an activated solder with elements added to the alloy that react with surfaces during joining and adhere to any surface films that normally disrupt wetting and bonding. The characteristics of S-Bond 220 include:
- Joining Temperature(s):
250 – 270oC (480 – 580 oF)
- Tensile Strengths:
>28-100 MPa (4,100 – 7,000 psi)
Tags: dissimilar materials, solder material
Posted in Products | No Comments »
May 18th, 2010
S-Bond Technologies and EWI have signed an agreement granting S-Bond Technologies the ability to distribute EWI’s patented lead-free, fluxless solder marketed by EWI as EWI SonicSolder®. The agreement is effective immediately. SonicSolder® is an active solder that permits the cost effective fluxless joining of aluminum, copper, other metals, glass, and ceramics without the need for plating.
Dr. Ronald Smith, President of S-Bond Technologies stated, “We are pleased to partner with EWI in growing the application of active, fluxless solder joining technologies. We see our partnership with EWI and our licensing of its SonicSolder® technology as an enhancement to our own patented active solder product line, S-Bond® and broadens our capabilities to provide more cost effective assembly solutions.” Henry Cialone, President and CEO of EWI said, “We’re excited to partner with S-Bond Technologies, further leveraging our patent in the marketplace. The partnership gives S-Bond a nice addition to its already strong portfolio of solder that will hopefully open up new markets for them with its cost-effective pricing.”
About EWI SonicSolder®
EWI SonicSolder® is an EWI patented binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join difficult-to-wet materials like aluminum, titanium, glass, and ceramics and dissimilar materials. Potential applications include tubing, electronics, medical products, and structural components. In various metal-metal (copper, aluminum, titanium) combinations, shear
strength of about 5 ksi has been obtained. The solder will be available in a variety of forms in early 2010 but currently ingot materials can be purchased. For more information, visit www.s-bond.com
About EWI
EWI is a leading engineering and technology organization dedicated to materials joining and allied technologies. We provide applied research, manufacturing support, and strategic services to nearly 2,800 member company locations of global leaders in the aerospace, automotive, defense, energy and chemical, government, heavy manufacturing, and electronics industries. Visit ewi.org for more information.
Tags: EWI, fluxless solder
Posted in Press Releases | No Comments »
July 13th, 2009
We are pleased to introduce our Blog as part of our commitment to communicate effectively with our customers, our prospective customers and anyone interested in our S-Bond, active solder bonding technology. This blog will feature news, technical updates, application updates, and general discussions about bonding and assembly of components.
We look forward to you visting our website and participating in the blog. As the blog develops interest, we hope to have good discussions about the active solder joining and related bonding technology and applications. Feel free to comment in our blog space.
Tags: S-Bond, Website
Posted in Company | No Comments »
July 12th, 2009
S-Bond was developed between 1995 – 2005 during which the materials and process technology has progressed to encompass the joining of most metals, semiconductors, ceramics and many composites of metals/ceramics. Key to the success of S-Bond active solders are they contain combinations of active metals such as titanium with rare earths such as cerium. These very active solders permit fluxless joining and eliminates the need for Ni or Cu plating before solder joining. SBT has also developed methods to actively solder bond and hermetically seal ceramics such as Al2O3, sapphire, quartz and zirconia. Please review our website, www.s-bond.com and take a look at our brochure and technical literature on the site. We would appreciate if you would share this blog and our website with your colleagues and customers, as S-Bond is an excellent solution for many dissimilar materials bonding applications.
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