S-Bond Technology

S-Bond Technology

At the core of our S-Bond products and bonding services is our Active Solder Technology.  S-Bond alloys are conventional solders that are made active when modified by the addition of key elements. These additions create a more chemically reactive solder that is able to bond with the surfaces of many materials, including surfaces coated with a layer of oxide or nitride. Depending upon the product, joining temperature, and substrate material, the bond can be based on a chemical reaction with the substrate, or result from a high level of atomic interaction between the S-Bond® product and the base material surface.  Contact Us to discuss your particular materials and strength requirements.

To learn more about our S-Bond technology, please see:

How S-Bond Works

S-Bond Joining Processes

S-Bond Joint Structures

 

Materials Joined by S-Bond Include:
Metals

Copper
Aluminum
Silicon
Titanium
Tungsten
Kovar®
Nickel
Gold
Silver
Stainless Steel

Ceramics

Silicon Carbide
Al-Nitride
Titanium Carbide
Alumina
Sapphire / Quartz
Zirconia
Tungsten Carbide
LTCC Materials
Silicon Carbide-Diamond

MMC's

Al-Silicon Carbide
Al-Graphite
Nickel-TiC
Metal-Diamond
Carbon
Graphite
Graphite Foam
C-C Composite
Pyrolytic Graphite
Diamond