The Source for Active Solder Alloys

Semiconductor Processing Equipment

Semiconductor processing euipment materials have to be thermally stable, capable of operationg in harsh environments and in many instances need to he actively cooled. S-Bond actiice solder are being widely adapted in sputtering targets, wafer handing, lithography equipment and in sensors and actuators. S-Bond solders can join aluminum and copper in thermal management devices and heat pipes. Our solders can also Si, SiC and other carbides and used in lithography, sensors and acuators.

Sensors and Actuators

S-Bond active solders can join most metals, ceramics and glass. Its unique ability to join dissimlar marterials provides many opportunites in sensors and acutators that use a range of exotoc metals, ceramiics, carbides and graphitic materials. With the use of combinations of these materials in sensors and actuators, our active solders are making the connections that eable these devices to function.

Bonding without fluxes or plating

Reducing bond contamination risks during brazing and soldering and eliminating the need for plating on metals typically used in metal to metal bonding and aluminum brazing. See how S-Bond Technology works.

Bonding of Ceramic to Metal

Ceramic metal bonding for joints that are hermetic and thermally conductive. Can be used to solder ceramics and is used in carbon bonding, and sapphire bonding. Active soldering in many applications can replace ceramic brazing. More information on Ceramic Bonding >>


Aluminum Joining

Aluminum bonding in one simple, flux free step and can replace aluminum brazing in many applications. Active solders eliminates the need to plate before soldering and aggressive chemical fluxes are not required thus post bond cleaning is not required.

Vacuum Brazing

Offering a range of vacuum brazing and bonding services, expanding our range of bonding services to our customers over and above our soldering services.

Thermal Management Components

Offering S-Bond solutions for bonding thermal pyrolytic graphite / graphene / graphite foams and other metals to fabricate innovative thermal management components

Low temperature bonding

Protecting sensitive assembly components… joing a range of materials with active solderis with melting temperatures ranging from 115 – 450˚C. Bonding services are provided that take advantage of all the attributes of active soldering such as aluminum bonding and ceramic metal bonding. For more information on active solder processing >>


Dissimilar Materials Joining

Brazing and soldering of dissimilar materials needs to accomodate differences in materials chemistry and thermal expansion properties of the materials being joined. Lower temperature metal bonding using S-Bond active solders, lowers thermal expansion mismatch stresses and the active elements in S-Bond solders permit these solders to wet and adhere to many base materials. For more information on dissimilar materials bonding >>


Ultrasonic Soldering Equipment Lease

Ultrasonic soldering systems, while very versatile for fluxless soldering, are a significant investment. For companies looking to self evaluate the technology at their own facilities without the full investment of a new system, S-Bond Technologies is offering monthly lease or lease to purchase plans for ultrasonic soldering systems. Contact us to inqure about this offer.


News & Highlights

ULA has recognized S-Bond Technologies with a Small Business Excellence Award for their support of the Vulcan Centaur program. As a materials technology company that provides bonding solutions for a broad range of materials,  S-Bond played an integral role in ...
S-Bond Technologies’ active solders are finding wide application in semiconductor processing equipment due to their capability to join a wide range of dissimilar materials and they are thermally and electrically conductive. Continue reading → ...
S-Bond® active solders are finding more application in these devices with these devices’ need for joining dissimilar materials, including metals, intermetallics, ceramics, composites and glasses. S-Bond® active solders are unique in that it can join these materials, without flux or plating, at low temperatures and with excellent conductivity (both electrical and thermal). Continue reading → ...
S-Bond® active solders enable graphite bonding and the joining of other carbon based materials to each other and to most metals within the constraints of thermal expansion mismatch. S-Bond® alloys have active elements such as titanium and cerium added to ...