IME Forms Chip-On-Wafer Consortium

Chip-on-wafer technologyChip-on-wafer technology could pave the way for higher-performance, slimmer and more cost-effective electronic devices.

Conventional Chip-on-Wafer bonding techniques used for making 3D chipsets rely on a solder-assisted thermo-compression bonding process that takes more than 15 seconds at a minimum of 300 degrees Celsius to complete. This method, which attaches the chip to a piece of semiconductor wafer, slows the overall production process and results in higher manufacturing costs.

AsianScientist (Dec. 29, 2014) – A*STAR’s Institute of Microelectronics (IME) has formed a Chip-on-Wafer (CoW) Consortium to enable semiconductor firms to develop commercially-viable capabilities for making 3D chipsets.

The consortium is working on overcoming such challenges by using low temperature copper-copper (Cu-Cu) diffusion bonding.

Read more at: http://www.asianscientist.com/2014/12/academia/ime-forms-chip-on-wafer-consortium/

Small-Scale Engineering Benefits From Aluminum Soldering

Aluminum BondingThe growth in unmanned aerial vehicles, more commonly known as drones, is still mainly in the military sector but with the announcement by Amazon.com head Jeff Bezos that deliveries may come from these devices, there is an increasing emphasis on their usage in private applications. To that end, aluminum soldering and other techniques will be necessary to reach their goals.

One person who is at the forefront of this industry is a former magazine editor, Chris Anderson. He told Popular Mechanics recently that the advent of tools commonly the domain of large-scale electronics manufacturer has enabled smaller outfits to achieve similar results, at least early in the prototyping stages. His company takes advantage of the widespread availability of computer-aided drawing and computer-aided manufacturing (CAD/CAM) software to work on projects before they even take form. Continue Reading Small-Scale Engineering Benefits From Aluminum Soldering