Lumichip, a leading developer of LED packaging solutions and light engines, has designed-in Cambridge Nanotherm’s thermal management technology for LEDs.
Thorough tests by Lumichip revealed Cambridge Nanotherm’s technology to have extraordinarily high levels of thermal performance, well beyond that of comparable solutions and approaching the thermal performance of exotic ceramic materials such as AIN (aluminium nitride). Lumichip has therefore selected Nanotherm’s technology as the basis for a series of technology-leading COB LED modules for UVA applications.
Click on the following link to read the full article about Lumichip designs-in Cambridge Nanotherm’s thermal management technology.
Cambridge Nanotherm has published results of a round of testing of several thermal PCB materials intended for use in LEDs, including its Nanoceramic thermal management substrates for LEDs. The tests were conducted by The LIA Laboratories (part of The LIA – Europe’s largest lighting trade association) and showed Cambridge Nanotherm’s thermal management technology outperforming all the thermal management substrates tested in terms of its thermal conductivity.
The LIA Laboratories test used 4 x 50 watt Intelligent LED Solutions Oslon 16+ PowerClusters mounted on four different MCPCB (Metal Clad PCB) substrates from leading manufacturers. Thermocouples measured the cluster and heat sink temperature at multiple locations. A calibrated integrating sphere measured the Lumens output.
Click on the following link to read the full article about Cambridge Nanotherm publishes results of first independent test of thermal management substrates for LEDs.
New zipper fin heat sinks from Advanced Thermal Solutions, Inc. (ATS) are protecting thousands of components from the dangers of excess heat at a lower cost than other high fin density heat sink types.
Zipper fins are machined from thin sheet metal, typically aluminum or copper, and are formed into custom shapes. The sheets are designed to interlock with a very narrow space between their layers. The fin assembly is wave soldered to a metal base forming a very rigid, lightweight heat sink.
Zipper fin heat sinks allow the combined use of copper and aluminum materials. In these designs, the copper base allows for optimal heat spreading while the aluminum fins ensure the heat sink will be lightweight.
Click on the following link to read the full article about ATS offers heat sinks that cool LEDs with high-density, lighter-weight zipper fins
In this interview, Douglas Hardy from H.C. Starck talks about how their molybdenum and tungsten metal, composite and laminate products are used in thermal management applications in the power industry.
The article contains interesting insights into what materials should be considered for thermal management, properties that make the materials useful in thermal applications and how the thermal management technology will evolve in the next few years.
Click on the following link to read the full article about Refractory Metals in Thermal Management for Power Semiconductors
Cambridge Nanotherm workshops on Thermal Management for LEDs will take place at Osram-hosted events on the afternoon of 14th April in Manchester and 16th April in Reading. Cambridge Nanotherm is also a key sponsor.
The two events will take place at 9am on 14th April at the Museum of Science and Industry, Manchester, and on 16th April at the Royal Berkshire Conference Centre, Madejski Stadium, Reading. The events will combine technical presentations, 30-minute technical workshops, and partner tabletop exhibitions.
Click on the following link to read the full article about Cambridge Nanotherm hosts LED thermal management workshops.
Gentherm (nasdaq-gs:THRM), the global market leader and developer of innovative thermal management technologies, announced today that the Company has been selected by S&P Dow Jones Indices to join the S&P SmallCap 600® after the close of trading on April 1, 2015.
The Company’s advanced technology team is developing more efficient materials for thermoelectric and systems for waste heat recovery and electrical power generation for the automotive market that may have far-reaching applications for consumer products as well as industrial and technology markets.
Click on the following link to read the full article about Gentherm Added To The Standard & Poor’s SmallCap 600® Index.
Chip-on-wafer technology could pave the way for higher-performance, slimmer and more cost-effective electronic devices.
Conventional Chip-on-Wafer bonding techniques used for making 3D chipsets rely on a solder-assisted thermo-compression bonding process that takes more than 15 seconds at a minimum of 300 degrees Celsius to complete. This method, which attaches the chip to a piece of semiconductor wafer, slows the overall production process and results in higher manufacturing costs.
AsianScientist (Dec. 29, 2014) – A*STAR’s Institute of Microelectronics (IME) has formed a Chip-on-Wafer (CoW) Consortium to enable semiconductor firms to develop commercially-viable capabilities for making 3D chipsets.
The consortium is working on overcoming such challenges by using low temperature copper-copper (Cu-Cu) diffusion bonding.
Read more at: http://www.asianscientist.com/2014/12/academia/ime-forms-chip-on-wafer-consortium/
As networking and processor chips continue to advance, innovative thermal management technologies are becoming more important.
Glass fiber/epoxy laminates have been the foundational structural substrate in printed circuit boards (PCBs) for decades. Glass/epoxy’s dominance, however, is under challenge as a variety of trends — notably, toward miniaturization, better thermal management, increased speed and performance, and the 3-D printing process — force PCB manufacturers to re-examine their material options.
As computers and mobile devices get smaller, faster and more sophisticated, more heat-producing internal electronics are packed into smaller spaces, increasing temperatures in PCB laminates and, thus, threatening performance. As devices get more compact, there is less room to accommodate a material’s expansion or contraction as internal temperature fluctuates. There also can be a mismatch between a PCB substrate’s CTE and the temperatures and dynamic loads it sees in service. Another issue threatening glass fiber/epoxy’s reign is conductive anodic filamentation (CAF), the result when copper corrosion residue grows along the glass fiber/resin interface in a PCB laminate as current passes from anode to cathode.
It is now possible to combine one of the variety of proven 3-D printing techniques with an established commercial printed electronics process and successfully build complete electronic products that exhibit the small feature sizes, high density and high performance now in demand.
To read the entire article go to: http://www.compositesworld.com/articles/printed-circuit-boards-a-mobile-market
3D printing seems to grow ever more popular year by year. Research and development into this field is growing at a rapid pace and expanding into new frontiers. While it is most commonly used for plastics and prototyping, some companies have been expanding the applications to include solder masking. One manufacturer seems to have made a significant advance with the use of imprint lithography to affix transistors to substrates. One offshoot of that may be the necessity for joining dissimilar materials using techniques such as aluminum soldering. Continue Reading 3D Printing, Masking, and Aluminum Soldering
It’s common knowledge that slapping a better heat sink, water cooler, or phase-change unit on a CPU can yield better overclocking results, but there’s more to the CPU cooling issue than simply bolting on a better heat sink. One of the biggest barriers to higher CPU clock speeds is hot spots.
So how do you fix that?
There are a few proposed methods. One alternative is to boost the efficiency of the thermal interface material (TIM). Intel has caught flack in recent years for using thermal paste, not solder, for its microprocessors. Another option is to improve lateral heat transfer within the CPU itself. Other approaches, like computational sprinting, could be combined with new phase change materials like wax to dramatically increase thermal dissipation for short periods of time.
Another solution to the heat issue is to adopt new materials. Certain element combinations from Groups III and V of the Periodic Table are well suited to high-frequency, low-voltage operation.
There’s a third idea out there that’s attracted significant interest in recent years. Why not leverage the advantages Moore’s law still offers to build fundamentally different kinds of chips?
Click here to view the full, original article “Post-post-PC: The new materials, tech, and CPU designs that will revive overclocking and enthusiast computing.”