Lumichip designs-in Cambridge Nanotherm’s thermal management technology

lumichip-UV-LED - Cambridge NanothermLumichip, a leading developer of LED packaging solutions and light engines, has designed-in Cambridge Nanotherm’s thermal management technology for LEDs.

Thorough tests by Lumichip revealed Cambridge Nanotherm’s technology to have extraordinarily high levels of thermal performance, well beyond that of comparable solutions and approaching the thermal performance of exotic ceramic materials such as AIN (aluminium nitride). Lumichip has therefore selected Nanotherm’s technology as the basis for a series of technology-leading COB LED modules for UVA applications.

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Cambridge Nanotherm First Independent Test Thermal Management Substrates LEDs

Thermal Management TechnologyCambridge Nanotherm has published results of a round of testing of several thermal PCB materials intended for use in LEDs, including its Nanoceramic thermal management substrates for LEDs. The tests were conducted by The LIA Laboratories (part of The LIA – Europe’s largest lighting trade association) and showed Cambridge Nanotherm’s thermal management technology outperforming all the thermal management substrates tested in terms of its thermal conductivity.

The LIA Laboratories test used 4 x 50 watt Intelligent LED Solutions Oslon 16+ PowerClusters mounted on four different MCPCB (Metal Clad PCB) substrates from leading manufacturers. Thermocouples measured the cluster and heat sink temperature at multiple locations. A calibrated integrating sphere measured the Lumens output.

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Free Online Manual for Automotive Aluminum Joining

Aluminum Joining in Automotive DesignThe Aluminum Association is offering a free online manual that describes in detail the range of commercial technologies that are available for joining automotive aluminum components. It was developed in response to the growing needs of automotive engineers and designers, who are using more aluminum alloys and multi-materials assemblies in their designs.

The multi-chapter Automotive Aluminim Joining Manual was developed in collaboration wiht the European Aluminum Association (EEA) and the US-based Aluminum Extruders Council (AEC).

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ATS Offers Heat Sinks That Cool LEDs With High-Density, Lighter-Weight Zipper Fins

Heat Sinks That Cool LEDsNew zipper fin heat sinks from Advanced Thermal Solutions, Inc. (ATS) are protecting thousands of components from the dangers of excess heat at a lower cost than other high fin density heat sink types.

Zipper fins are machined from thin sheet metal, typically aluminum or copper, and are formed into custom shapes. The sheets are designed to interlock with a very narrow space between their layers. The fin assembly is wave soldered to a metal base forming a very rigid, lightweight heat sink.

Zipper fin heat sinks allow the combined use of copper and aluminum materials. In these designs, the copper base allows for optimal heat spreading while the aluminum fins ensure the heat sink will be lightweight.

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Refractory Metals in Thermal Management for Power Semiconductors

Copper/Molybdenum/Copper Laminates - Thermal Management MaterialsIn this interview, Douglas Hardy from H.C. Starck talks about how their molybdenum and tungsten metal, composite and laminate products are used in thermal management applications in the power industry.

The article contains interesting insights into what materials should be considered for thermal management, properties that make the materials useful in thermal applications and how the thermal management technology will evolve in the next few years.
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Cambridge Nanotherm hosts LED thermal management workshops

Led technologyCambridge Nanotherm workshops on Thermal Management for LEDs will take place at Osram-hosted events on the afternoon of 14th April in Manchester and 16th April in Reading. Cambridge Nanotherm is also a key sponsor.

The two events will take place at 9am on 14th April at the Museum of Science and Industry, Manchester, and on 16th April at the Royal Berkshire Conference Centre, Madejski Stadium, Reading. The events will combine technical presentations, 30-minute technical workshops, and partner tabletop exhibitions.

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Gentherm Added To The Standard & Poor’s SmallCap 600® Index

Gentherm Battery Thermal ManagementGentherm (nasdaq-gs:THRM), the global market leader and developer of innovative thermal management technologies, announced today that the Company has been selected by S&P Dow Jones Indices to join the S&P SmallCap 600® after the close of trading on April 1, 2015.

The Company’s advanced technology team is developing more efficient materials for thermoelectric and systems for waste heat recovery and electrical power generation for the automotive market that may have far-reaching applications for consumer products as well as industrial and technology markets.

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IME Forms Chip-On-Wafer Consortium

Chip-on-wafer technologyChip-on-wafer technology could pave the way for higher-performance, slimmer and more cost-effective electronic devices.

Conventional Chip-on-Wafer bonding techniques used for making 3D chipsets rely on a solder-assisted thermo-compression bonding process that takes more than 15 seconds at a minimum of 300 degrees Celsius to complete. This method, which attaches the chip to a piece of semiconductor wafer, slows the overall production process and results in higher manufacturing costs.

AsianScientist (Dec. 29, 2014) – A*STAR’s Institute of Microelectronics (IME) has formed a Chip-on-Wafer (CoW) Consortium to enable semiconductor firms to develop commercially-viable capabilities for making 3D chipsets.

The consortium is working on overcoming such challenges by using low temperature copper-copper (Cu-Cu) diffusion bonding.

Read more at: http://www.asianscientist.com/2014/12/academia/ime-forms-chip-on-wafer-consortium/

Building the Next Generation of Efficient Computers – Multiferroic Materials

As wireless and mobile systems advance, thermal management technologies will be crucial to their development.

As wireless and mobile systems advance, thermal management technologies will be crucial to their development.

Bryan Huey, a UConn researcher, has uncovered new information about the kinetic properties of multiferroic materials that could be the key breakthrough scientists have been looking for to create a new generation of low-energy, highly efficient, instant-on computers.

Materials known as multiferroics have shown great promise for creating a low-energy memory storage and processing device because they have the rare ability to be both magnetic and ferroelectric, meaning they can be sensitive to magnetic and electric fields simultaneously.

The findings were featured in the Dec. 17, 2014 issue of Nature, considered one of the world’s most prestigious scientific research journals.Read more at: http://today.uconn.edu/blog/2015/01/building-the-next-generation-of-efficient-computers/

How GM Will Use Multiple Aluminum Joining Technologies in the New Cadillac

Multiple Aluminum Joining Technologies in the New CadillacIn manufacturing engineering, the search for the “best way” to fasten components into subassemblies is a major part of the job. There are lots of options, spot welding has been the method of choice for decades.

Now that aluminum is becoming the preferred unibody construction material, General Motors is using a novel mixed approach to building the new Cadillac CT6 large sedan.

The Cadillac CT6 will use 7 different ways to join body parts.

Low-cost aluminum joining technologies could make lower volume sub-assemblies more economical.

“Never before has an automaker brought this combination of joining techniques together for a single vehicle,” said Travis Hester, CT6 executive chief engineer. “The manufacturing team has enabled body engineers to optimize the vehicle for mass, safety, stiffness and materials with more precision than ever.
Read more at: http://www.engineering.com/AdvancedManufacturing/ArticleID/9468/How-GM-Will-Use-Multiple-Aluminum-Joining-Technologies-in-the-New-Cadillac.aspx