The Aluminum Association is offering a free online manual that describes in detail the range of commercial technologies that are available for joining automotive aluminum components. It was developed in response to the growing needs of automotive engineers and designers, who are using more aluminum alloys and multi-materials assemblies in their designs.
The multi-chapter Automotive Aluminim Joining Manual was developed in collaboration wiht the European Aluminum Association (EEA) and the US-based Aluminum Extruders Council (AEC).
Click on the following link to read the full article about Free Online Manual for Automotive Aluminum Joining.
New zipper fin heat sinks from Advanced Thermal Solutions, Inc. (ATS) are protecting thousands of components from the dangers of excess heat at a lower cost than other high fin density heat sink types.
Zipper fins are machined from thin sheet metal, typically aluminum or copper, and are formed into custom shapes. The sheets are designed to interlock with a very narrow space between their layers. The fin assembly is wave soldered to a metal base forming a very rigid, lightweight heat sink.
Zipper fin heat sinks allow the combined use of copper and aluminum materials. In these designs, the copper base allows for optimal heat spreading while the aluminum fins ensure the heat sink will be lightweight.
Click on the following link to read the full article about ATS offers heat sinks that cool LEDs with high-density, lighter-weight zipper fins
In this interview, Douglas Hardy from H.C. Starck talks about how their molybdenum and tungsten metal, composite and laminate products are used in thermal management applications in the power industry.
The article contains interesting insights into what materials should be considered for thermal management, properties that make the materials useful in thermal applications and how the thermal management technology will evolve in the next few years.
Click on the following link to read the full article about Refractory Metals in Thermal Management for Power Semiconductors
Cambridge Nanotherm workshops on Thermal Management for LEDs will take place at Osram-hosted events on the afternoon of 14th April in Manchester and 16th April in Reading. Cambridge Nanotherm is also a key sponsor.
The two events will take place at 9am on 14th April at the Museum of Science and Industry, Manchester, and on 16th April at the Royal Berkshire Conference Centre, Madejski Stadium, Reading. The events will combine technical presentations, 30-minute technical workshops, and partner tabletop exhibitions.
Click on the following link to read the full article about Cambridge Nanotherm hosts LED thermal management workshops.
Gentherm (nasdaq-gs:THRM), the global market leader and developer of innovative thermal management technologies, announced today that the Company has been selected by S&P Dow Jones Indices to join the S&P SmallCap 600® after the close of trading on April 1, 2015.
The Company’s advanced technology team is developing more efficient materials for thermoelectric and systems for waste heat recovery and electrical power generation for the automotive market that may have far-reaching applications for consumer products as well as industrial and technology markets.
Click on the following link to read the full article about Gentherm Added To The Standard & Poor’s SmallCap 600® Index.