IME Forms Chip-On-Wafer Consortium

Chip-on-wafer technologyChip-on-wafer technology could pave the way for higher-performance, slimmer and more cost-effective electronic devices.

Conventional Chip-on-Wafer bonding techniques used for making 3D chipsets rely on a solder-assisted thermo-compression bonding process that takes more than 15 seconds at a minimum of 300 degrees Celsius to complete. This method, which attaches the chip to a piece of semiconductor wafer, slows the overall production process and results in higher manufacturing costs.

AsianScientist (Dec. 29, 2014) – A*STAR’s Institute of Microelectronics (IME) has formed a Chip-on-Wafer (CoW) Consortium to enable semiconductor firms to develop commercially-viable capabilities for making 3D chipsets.

The consortium is working on overcoming such challenges by using low temperature copper-copper (Cu-Cu) diffusion bonding.

Read more at: http://www.asianscientist.com/2014/12/academia/ime-forms-chip-on-wafer-consortium/

Building the Next Generation of Efficient Computers – Multiferroic Materials

As wireless and mobile systems advance, thermal management technologies will be crucial to their development.

As wireless and mobile systems advance, thermal management technologies will be crucial to their development.

Bryan Huey, a UConn researcher, has uncovered new information about the kinetic properties of multiferroic materials that could be the key breakthrough scientists have been looking for to create a new generation of low-energy, highly efficient, instant-on computers.

Materials known as multiferroics have shown great promise for creating a low-energy memory storage and processing device because they have the rare ability to be both magnetic and ferroelectric, meaning they can be sensitive to magnetic and electric fields simultaneously.

The findings were featured in the Dec. 17, 2014 issue of Nature, considered one of the world’s most prestigious scientific research journals.Read more at: http://today.uconn.edu/blog/2015/01/building-the-next-generation-of-efficient-computers/

How GM Will Use Multiple Aluminum Joining Technologies in the New Cadillac

Multiple Aluminum Joining Technologies in the New CadillacIn manufacturing engineering, the search for the “best way” to fasten components into subassemblies is a major part of the job. There are lots of options, spot welding has been the method of choice for decades.

Now that aluminum is becoming the preferred unibody construction material, General Motors is using a novel mixed approach to building the new Cadillac CT6 large sedan.

The Cadillac CT6 will use 7 different ways to join body parts.

Low-cost aluminum joining technologies could make lower volume sub-assemblies more economical.

“Never before has an automaker brought this combination of joining techniques together for a single vehicle,” said Travis Hester, CT6 executive chief engineer. “The manufacturing team has enabled body engineers to optimize the vehicle for mass, safety, stiffness and materials with more precision than ever.
Read more at: http://www.engineering.com/AdvancedManufacturing/ArticleID/9468/How-GM-Will-Use-Multiple-Aluminum-Joining-Technologies-in-the-New-Cadillac.aspx