Active Soldering Archives - Page 2 of 2

S-Bond 220M Developed for Silicon/Silicate Joining

sbondadmin October 10, 2011

The direct solder joining of silicon is difficult posing solder wetting and adherence challenges for many applications including electronic “die” packages, sensor chips and solar panels. The direct solder bonding to silicon (Si) has been limited by the wetting resistance of angstrom thick nascent silicon dioxide (SiO2) layers that naturally forms on silicon. To combat these solder bonding challenges, metal plating (vapor deposition of Ti and Ni) has been used. To address this challenge, S-Bond Technologies has developed and has recently been awarded a patent for its S-Bond 220M alloy which is a Sn-Ag-Ti-Ce-Ga + Mg alloy that has been optimized for direct Si solder bonding without flux nor plating. The new alloy bonds well to silicon, silica, and glass silicates based on a solder formulation that adds magnesium (Mg) in low enough levels that does not change the solder melt behavior but enhances the “active” nature of S-Bond alloys to interact with oxides of silicon and many other metals even more effectively than other active solders. These Mg modified active solders wet and adhere very well to silicon based on mechanical activation used in other active solders. (more…)

Metal Soldering with Active Solders

sbondadmin October 10, 2011

Active solders such as S-Bond have wide application in joining a wide variety of metals including aluminum, copper, stainless steel, titanium, all based on S-Bond alloys’ ability to directly wet and adhere to the metallic surface compounds. Using mechanical activation active solders such as S-Bond successfully join like and dissimilar metal combinations in a wide variety of applications, from heat sinks and sensors to medical/surgical devices. (more…)

Active Solder… What-Why-How

sbondadmin July 8, 2011

What is meant by “active solder”? The term evolves from active brazing; I assume that does not really help you…. But it is true that active brazing was the key technology that led to the development of active solders. (more…)

Can S-Bond Soldered Joints be Coated ?

sbondadmin May 16, 2011

Many times our customers have to coat assemblies operations after aluminum bonding, graphite bonding, ceramic to metal bonding, etc; this can present certain challenges that one should be aware of since soldered joints. Unlike welded and many brazed joints, soldered joints utilize a significantly different filler metal. In the case of S-Bond solders, Sn-Ag is the common base filler that is used in aluminum bonding as well as copper, steel, stainless steel, refractory metals, and titanium and many other metals. As such, then the properties of the joint MUST be considered when coating. (more…)

Mechanical Activation of Active Solders

sbondadmin April 6, 2011

Mechanical vs Chemical Fluxing During Solder Bonding

Flux is derived from Latin word fluxus meaning “flow.” In solder joining (also aluminum soldering, graphite bonding, ceramic to metal brazing, etc.), a flux facilitates wetting by molten metals disrupting oxides on metal surfaces which interrupt the reaction/interaction of the molten solder metals with the underlying metal. Additionally, flux allows solder to flow easily on the working piece rather than forming beads as it would otherwise. (more…)

S-Bond Develops Fluxless “Hybrid” Soldering Techniques

sbondadmin May 18, 2010

Hybrid S-Bond joining processes eliminate the use of fluxes and have been shown to be more effective since it completely joins with the S-Bond filler metals. The methods that are recommended to minimize the use of S-Bond, yet still achieve fluxless joining are as follows: (more…)

What is S-Bond® 220?

sbondadmin May 18, 2010

S-Bond 220 is a solder material (Sn-Ti-Ag) and a process by which most materials, including dissimilar metallic and ceramic materials can be joined. It is a new family of solders, developed and patented by S-Bond Technologies. The material is an activated solder with elements added to the alloy that react with surfaces during joining and adhere to any surface films that normally disrupt wetting and bonding. The characteristics of S-Bond 220 include: (more…)

S-Bond Active Solder Bonding

sbondadmin July 12, 2009

S-Bond was developed between 1995 – 2005 during which the materials and process technology has progressed to encompass the joining of most metals, semiconductors, ceramics and many composites of metals/ceramics. Key to the success of S-Bond active solders are they contain combinations of active metals such as titanium with rare earths such as cerium. These very active solders permit fluxless joining and eliminates the need for Ni or Cu plating before solder joining. SBT has also developed methods to actively solder bond and hermetically seal ceramics such as Al2O3, sapphire, quartz and zirconia. Please review our website, www.s-bond.com and take a look at our brochure and technical literature on the site. We would appreciate if you would share this blog and our website with your colleagues and customers, as S-Bond is an excellent solution for many dissimilar materials bonding applications. (more…)

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