Graphite and carbon felts are increasingly being used for applications in solar, LED, medical, semiconductor, automotive and energy storage systems.
S-Bond Technologies (SBT) has customized it S-Bond (S-B) processes to bond graphite felts to metals for such applications. In the process, graphite felts are first S-B metallized using a paste and vacuum process to create a metallurgical bond between graphite and the SBT active solder filler metals. After S-B metalizing of the graphite, only the tips of the felt surfaces are metallized and thus solderable to the opposing metal plates that are coated with SBT active solders. The S-B metallization process does not fill the open cells of the graphite felts with S-B alloys, hence its advantage for bonding open cell structures.
The component parts of a graphite lined plate is shown to the left… the graphite felt lays in the center of a metallic plate in advance of being prepared for bonding.
In the images to the left, the graphite felt is S-B metallized to leave the tips of the felt with solderable surfaces. After treatment then a layer of SBT active solder is placed on the graphite felt as seen in the right of this photograph. This solder layer is subsequently bonded to metal plates, as seen in the images below.
The figures above show the placement of the treated solderable graphite being placed and soldered to a heated (molten) S-B solder coated metal plate. The felt is then pressed in place while the SBT solders are molten and then cooled to solidify and bond the felt to the metal plate. The result is a solder bonded graphite felt on metals for use in electrodes.