New Lower Temperature Active Solders Developed

S-Bond Technologies has developed and proven a new, lower temperature active solder that melts from 135 – 140°C. The solder, S-Bond® 140 is based around the Bismuth-Tin (Bi-Sn) eutectic composition. This new solder is a lower temperature active solder that enables multi-step soldering where previously soldered connections/seals are not remelted. Active solders that melt below 150C are also finding use in thermally sensitive applications where Sn-Ag based solders that melt over 215°C can thermally degrade the component parts being assembled. Lower temperature soldering also can more effectively bond dissimilar materials where thermal expansion mismatch many times fractures or distorts an assembly’s component parts.

S-Bond 140 is already finding application in glass-metal seals in electronic packages where higher temperature soldering alloys would have damaged the packages’ components. S-Bond 140 is also being used to bond heat pipes and vapor chamber thermal management devices to protect the thermally sensitive phase change fluids from damaging the devices when solder bonding to electronic and LED devices.

Electro-optical package to be bonded to heat sink with S-Bond® 140

Electro-optical package to be bonded to heat sink with S-Bond® 140

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