Technology For Advanced Solutions
At the core of all SBT products and bonding services is its Active Solder Technology. S-Bond alloys are conventional solders that are made active when modified by the addition of key elements which create a more chemically reactive solder that forms a bond with surfaces, including surfaces coated with a layer of oxide or nitride. Depending upon the product, joining temperature, and substrate material, the bond can be based on a chemical reaction with the substrate, or result from a high level of atomic interaction between the S-Bond® product and the surface.
To view our S-Bond technology, see the links:
For further information on our products and their applications see Productsand Applications
Please Contact Us for further information on your particular materials and strength requirements.
Examples of Materials Joined by S-Bond:
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Metals
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Ceramics
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MMC's
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Copper
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Silicon Carbide
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Al-Silicon Carbide
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Aluminum
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Al-Nitride
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Al-Graphite
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Silicon
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Titanium Carbide
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Nickel-TiC
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Titanium
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Alumina
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Metal-Diamond
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Tungsten
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Sapphire / Quartz
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Carbon
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Kovar®
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Zirconia
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Graphite
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Nickel
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Tungsten Carbide
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Graphite Foam
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Gold
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LTCC Materials
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C-C Composite
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Silver
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Silicon Carbide-Diamond
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Pyrolytic Graphite
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Stainless Steel
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Diamond
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