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The increased use of new materials for improved thermal
management and lower cost is challenging conventional
joining processes. SBT products have been shown to
bond to silicon dies and MEMS without the need to
coat or metallize prior to joining. These materials
also join well to copper-tungsten, alumina, silicon
carbide, nickel, and other materials used in lids
and substrates. These capabilities offer the possibility
for direct die attachment to a package lid, joining
of MEMS and other devices into lead frames, and direct
attachment of silicon or silicon carbide devices to
heat sinks and heat spreaders. Additionally, in the
area of power electronics, S-Bond® materials can
be used to bond IGBT modules directly to base plates
of copper-tungsten, aluminum silicon carbide, aluminum
nitride, and nickel coated versions of these materials.
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The need for light weight, high performance thermal
management systems is moving from the traditional
military and aerospace applications into industrial
and consumer electronics as ever increasing speeds
in ever smaller devices calls for the use of new materials.
Metal matrix composites such as aluminum silicon carbide,
ceramics such as silicon carbide and aluminum nitride,
and graphite structures such as pyrolytic graphite
and foamed graphite are all being used to improve
thermal performance without adding weight. SBT solders
are unique in there ability to give a high performance
thermal joint between, and bond to, these materials
as well as to metals like aluminum and copper. Our
materials offer approximately 10 times the thermal
conductivity of thermal epoxies along with the ability
to bond in air, without the use of fluxes, and to
have a bond that allows rework of damaged parts. Some
of the specific applications that can benefit from
this are avionics, laser systems, and high performance
computers.
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Copper, aluminum, and copper-aluminum composite structures
are commonly used to create heat sinks for electronics,
medical imaging devices, and industrial equipment.
These are traditionally assembled using flux and conventional
solders, while also nickel plating the aluminum. S-Bond
solder materials join well to these metals, and frequently
offer a lower cost-in-use compared to a conventional
joining process. SBT offers several options of joining
including several solder materials and a brazing material
that work without flux or aluminum plating. Depending
on the needs of the application, this can offer a
lower cost-in-use and reduced waste generation compared
to conventional processes by eliminating plating baths,
flux application, flux fume removal, and flux cleaning.
Please consult our Products
page, or Contact Us
for help with your particular application.
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High performance microprocessors need new ideas for thermal management if
they are to continue to increase in speed. One option is to improve TIM1
performance through the use of direct die attach using solder materials.
Conventional attachment techniques using filled polymers can't offer the
same level of thermal conductivity as a completely metal bond, but directly
bonding to silicon and packaging materials typically requires the use of a
flux or thin film metallization of the joining surfaces. SBT offers options
for bonding to silicon and metal, ceramic, or ceramic composite materials
without metallization or flux which, in some cases, can withstand lead free
solder reflow cycles for board mounting.
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Soldering to aluminum requires special fluxes or techniques
to break through the natural surface oxide film and
allow the flux to bond. SBT solders easily break through
the oxide layer to react quickly and irreversibly
with the aluminum metal without the use of additional
chemicals. There are a range of solders available
with different service temperatures from 100°C
to 390°C as well as a broad range of bond strengths.
These same products also join well to copper, aluminum
silicon carbide, and other thermal management materials
and allow fluxless assembly of complete thermal management
systems. Please consult our Products
page, or Contact Us for
assistance with your application.
Our engineers, technicians, and scientists are experienced
with all aspects of joining and assembly processes,
as well as the design requirements for many different
applications. As part of our commitment to service,
we are happy to offer advice on the proper joining
material for your application, provide recommendations
on optimum design, and provide guidance on implementing
a commercial process. We also offer a range of application
development, prototype construction, and assembly
services in our shop and through our S-Bond Service
Provider network. These include:
Assembly of prototype parts for customer testing and
determination of commercial scale production costs;
Design of tooling and assembly processes, including
demonstration of commercial assembly processes;
“Make complete” for systems assembled
with our materials, such as thermal management devices
and equipment subassemblies;
High volume contract manufacturing.
Our goal is to make the adoption and use of our materials
as easy as possible, and we are happy to work with
you to satisfy your needs for engineering, design,
and manufacturing services.
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