S-Bond Technologies solders join many combinations of dissimilar materials over a range of temperatures using its active solders that are Pb-fee and fluxless. The solders allow for lower temperature, low contamination joining of metals, ceramics and composites. This joining technology is finding widespread application in a broad range of components. This section previews applications that have been successful.
Please preview the various application areas in this site segment and Contact Us if we may be of service to your organization.
If you do not see your application, please contact us to evaluate whether S-Bond's attributes meet your component's service requirements.