Organization and Facilities
S-Bond Technologies. LLC was spun out of Materials Resources International in 2004 to commercialize its active solder technology. Since then S-Bond Technologies (SBT) has consistently grown as applications for S-Bond joining has grown. MRi and SBT were started and are led by Dr. Ronald Smith who has spent 10 years at GE Gas Turbine and GE Aircraft Engine, then spent 10 years at Drexel University as a Research Professor before starting MRi and SBT. In order to increase its manufacturing capabilities, SBT added Mr. Gabe Sulyok as its Manufacturing Operations Manager. He brings over 25 years of operations and industrial engineering experience to enhance the facility’s manufacturing capabilities and support our customers’ production needs.
SBT’s Active Solder Technology first developed in the late 1990's as a technique to join metals without using flux. The technology continued to be developed and refined by Materials Resources International until 2002, when SBT was spun off. Since then SBT has focused on creating specific assembly solutions for the electronics, defense, aerospace, and general industrial markets.
S-Bond Technology's products are used today in thermal management systems, sensor assemblies, electronics, and a host of other applications where good bond strength, high thermal and electrical conductivity, and a reduced environmental impact are important.
S-Bond Technologies has over 6,500 ft2 of engineering, development and manufacturing space dedicated to providing S-Bond solutions. This space includes ovens, hot plates, ultrasonic agitation tools and presses as well as a fully equipped assembly facility. SBT also offers Helium leak check and ultrasonic C-Scan testing for assuring the integrity of S-Bond joints.
