Active Solder Technology

Our products are used to join metals, ceramics, glasses, and carbon materials like diamond and graphite. Using our expertise in Active Solder Technology, we have developed a range of solutions that allows the cost effective assembly of unique combinations of materials without plating and fluxes. Examples include copper to aluminum and graphite to aluminum for thermal management systems, sapphire to metal for lightweight sensor assemblies, and silicon carbide to titanium and other metals for lightweight armor and wear resistant surfaces.

We also offer design-for-manufacturing review, prototyping, and "make complete" services based on our experience and that of our S-Bond® Service Provider Network.

FEATURED APPLICATIONS