Brazing-Soldering / Metal Bonding / Active Solder Technology
S-Bond Technologies offers a wide range of bonding and related services including:
- S-Bond joining [ our patented active solder joining processes and materials ]
- Soldering
- Brazing
- EWI SonicSolder
- Ultrasonic bonding
- Bonded / Clad Carbide Wear Coatings
- Bond inspection
Thermal Management
S-Bond joins Al- Al , Al-Cu, Cu-Cu and Al-SiC and is finding extensive application in the bonding of cold plates, vapor chambers, heat sinks and other thermal management components. There is no flux used in joining, so post bond cleaning is not required and there is no residual flux entrapment in joints. S-Bond joins other emerging high conductivity materials such as metallic foams, graphite foams, pyrolytic graphite and diamond. Low void bonding increases thermal conductivity and leads to improved heat sink performance.
Solar Panel Joining
S-Bond solders have been shown to be effective in bonding metallic conductors to silicon and glass (coated and uncoated) panel surfaces, ideal for bnding conductors and heat sinks on solar panel and conductors on smart glass . Bonding employs a thermasonic technique that requires the pre-application of the S-Bond alloys onto the conductor and localized heating of panels, followed by mechanical agitation to join the silicon or glass surfaces without flux. S-Bond joining processes are in development that will enable large panels to be joined to various conductors.
Sensors
Sensors and sensor housings require metal to metal and/or metal to ceramic bonds that make electrical connections or hermetic seals. S-Bond active solders and related processes are being used to make a wide variety of sensor components, including graphite and SiC to conductor leads for conductivity sensors, and also sapphire or quartz to titanium, Kovar® or stainless steel. These components are successfully used to make optical sensors and other sensor enclosures.
