S-Bond Solder Alloys
Our Products
Our materials are modifications of conventional solder formulations that wet and bond without the use of flux. All formulations are lead and cadmium free and conform to the requirements of all lead free solder initiatives (RoHS, etc.). Formulations are available in ingot, wire, foil, pellet, and custom preforms. Please contact our Customer Service department for lead times for specific forms of a product as well as current pricing.
Products |
Description | Maximum Service Temperature | Initial Melting Point (Solidus) | Fully Liquid Point (Liquidus) |
SB115* | Indium/Tin | ~100°C/212°F | ~115°C/240°F | ~120ºC/248°F |
SB140* | Bismuth/Tin | ~125°C/257°F | ~135°C/275°F | ~150°C/302°F |
SB220 | Tin/Silver | 190°C/374°F | 221°C/428°F | 232°C/447°F |
SB220-50 | Low Cost Al & Cu Joining | 190°C/374°F | 221°C/428°F | 232°C/447°F |
SB400 | Zinc/Aluminum | 390°C/734°F | 405°C/760°F | 415°C/780°F |
* Developmental products with limited availability.