High performance microprocessors need new ideas for thermal management if they are to continue to increase in speed. One option is to improve TIM1 performance through the use of direct die attach using solder materials.

Conventional attachment techniques using filled polymers can't offer the same level of thermal conductivity as a completely metal bond, but directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces.

SBT offers options for bonding to silicon and metal, ceramic, or ceramic composite materials without metallization or flux which, in some cases, can withstand lead free solder reflow cycles for board mounting.