Copper, aluminum, and copper-aluminum composite structures are commonly used to create heat sinks for electronics, medical imaging devices, and industrial equipment. These are traditionally assembled using flux and conventional solders, while also nickel plating the aluminum.
S-Bond® solder materials join well to these metals, and frequently offer a lower cost-in-use compared to a conventional joining process. SBT offers several options of joining including several solder materials and a brazing material that work without flux or aluminum plating.
Depending on the needs of the application, this can offer a lower cost-in-use and reduced waste generation compared to conventional processes by eliminating plating baths, flux application, flux fume removal, and flux cleaning.
Solutions and Service
Heat Sinks