The need for light weight, high performance thermal management systems is moving from the traditional military and aerospace applications into industrial and consumer electronics as ever increasing speeds in ever smaller devices call for the use of new materials.

Metal matrix composites such as aluminum silicon carbide, ceramics such as silicon carbide and aluminum nitride, and graphite structures such as pyrolytic graphite and foamed graphite are all being used to improve thermal performance without adding weight.

S-Bond® solders are unique in their ability to give a high performance thermal joint between, and bond to, these materials, as well as to metals like aluminum and copper. Our materials offer approximately 10 times the thermal conductivity of thermal epoxies along with the ability to bond in air without the use of fluxes, and to have a bond that allows rework of damaged parts. Some of the specific applications that can benefit from this are avionics, laser systems, and high performance computers.