The increased use of new materials for improved thermal management and lower cost is challenging conventional joining processes. SBT products have been shown to bond to silicon dies and MEMS without the need to coat or metallize prior to joining. These materials also join well to copper-tungsten, alumina, silicon carbide, nickel, and other materials used in lids and substrates.

These capabilities offer the possibility for direct die attachment to a package lid, joining of MEMS and other devices into lead frames, and direct attachment of silicon or silicon carbide devices to heat sinks and heat spreaders.

Additionally, in the area of power electronics, S-Bond® materials can be used to bond IGBT modules directly to base plates of copper-tungsten, aluminum silicon carbide, aluminum nitride, and nickel coated versions of these materials.