Customer Service

For technical questions, application development assistance, and service quotations please contact:

Applications Engineering
Tel: 215-631-7114, extension 102
Fax: 215-631-7115

 

Ordering
For information on pricing and ordering of research kits and materials please contact:

Customer Service
Tel: 215-631-7114, extension 100
Fax: 215-631-7115

Company History
Our staff is happy to provide you with technical support and information on how our products can be used in your application. Our commitment is to provide you with more than material, but rather to work with you from the design stage through prototyping, scale-up, and process validation. With deep experience in materials science, mechanical engineering, and process design we are able to shorten your development cycle, simplify assemblies, and frequently offer options that reduce cost. We can also offer choices in how to implement our materials in manufacturing your product.
Mailing Address
S-Bond Technologies LLC
811 West Fifth Street - Unit 2
Lansdale, PA 19446
Active Solder Technology first developed in the late 1990's as a technique to join metals without using flux.  The technology continued to be developed and refined by Materials Resources International until 2002, when SBT was spun off as a separate company.  Since then the company has focused on creating specific joining and assembly solutions for the electronics, defense, aerospace, and general industrial markets.
 
S-Bond Technology's products are used today in thermal management systems, sensor assemblies, and other applications where good bond strength, high thermal and electrical conductivity, and a reduced environmental impact are important.