S-Bond Technologies “Industry News” Webpage

S-Bond Technologies has added a News section to its website. This news section is focused on industry and technology developments that may be of general interest to you or may impact your business. Our Industry News feed will be updated during each month as targeted technology and industry news is identified.  Dr. Ronald Smith, President of S-Bond Technologies says “Our Company is materials technology focused with solutions in metals and ceramic bonding that are well suited for dissimilar materials joining, aluminum bonding, and ceramic to metal bonding. Applications for our technology include thermal management, alternative energy, sensors, electronics, aerospace and automotive. We are providing this Industry News section focused on applications that benefit from bonding technology as a feature for our website visitors and customers.”

This industry news provided at our website www.s-bond.com centers on materials technology in industry where bonding/soldering/brazing challenges are prevalent. The News section articles will be available in an S-Bond News Team periodic email that will feature the most recent news articles.

Please if you want to opt-in on our periodic S-Bond News Team communication… please click the link below. If you do not opt-in, you can still see the news by visiting our website, www.s-bond.com . If you do not opt-in, you will remain on our S-Bond e-Newsletter that features S-Bond related technical articles.

Opt-In for the S-Bond News Team communication.

New Lower Temperature Active Solders Developed

S-Bond Technologies has developed and proven a new, lower temperature active solder that melts from 135 – 140°C. The solder, S-Bond® 140 is based around the Bismuth-Tin (Bi-Sn) eutectic composition. This new solder is a lower temperature active solder that enables multi-step soldering where previously soldered connections/seals are not remelted. Active solders that melt below 150C are also finding use in thermally sensitive applications where Sn-Ag based solders that melt over 215°C can thermally degrade the component parts being assembled. Lower temperature soldering also can more effectively bond dissimilar materials where thermal expansion mismatch many times fractures or distorts an assembly’s component parts.

S-Bond 140 is already finding application in glass-metal seals in electronic packages where higher temperature soldering alloys would have damaged the packages’ components. S-Bond 140 is also being used to bond heat pipes and vapor chamber thermal management devices to protect the thermally sensitive phase change fluids from damaging the devices when solder bonding to electronic and LED devices.

Electro-optical package to be bonded to heat sink with S-Bond® 140

Electro-optical package to be bonded to heat sink with S-Bond® 140

S-Bond® Solders At the Interface of the NanoBond® Process

Figure 1. Illustration of the NanoBond® / NanoFoil® heating process® (from www.indiumcorp.com)

Figure 1. Illustration of the NanoBond® / NanoFoil® heating process® (from www.indiumcorp.com)

S-Bond active solder layers have been shown in many applications to be the key ingredient that permits many ceramics and refractory metals to be bonded to largely coefficient of thermal expansion (CTE) mismatched metals such as aluminum and copper. Indium Corporation offers a NanoBond® process that uses NanoFoil ® as local heat source to remelt preplaced solder layers without the need for the bulk heating of assembled components that have large CTE mismatch. Active S-Bond solders are applied as prelayers and have Ti, Ce, Ga and Mg additions that permit them to wet any ceramic or metal surface. Once the S-Bond pre-layers are applied to ceramic and/or metallic surfaces, conventional solders can be reflowed onto the S-Bond layer to create the preplaced solder layers that are remelted and bonded via the heat emitted from an ignited NanoFoil®. Figure 1 illustrates how temperatures of over 1,400 K are generated by an ignited nano-engineered foil. Read more about S-Bond® Solders At the Interface of the NanoBond® Process