Bonding Graphite Felts To Metals

Graphite and carbon felts are increasingly being used for applications in solar, LED, medical, semiconductor, automotive and energy storage systems.

S-Bond Technologies (SBT) has customized it S-Bond (S-B) processes to bond graphite felts to metals for such applications. In the process, graphite felts are first S-B metallized using a paste and vacuum process to create a metallurgical bond between graphite and the SBT active solder filler metals. After S-B metalizing of the graphite, only the tips of the felt surfaces are metallized and thus solderable to the opposing metal plates that are coated with SBT active solders.  The S-B metallization process does not fill the open cells of the graphite felts with S-B alloys, hence its advantage for bonding open cell structures.
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S-Bond® Solders At the Interface of the NanoBond® Process

Figure 1. Illustration of the NanoBond® / NanoFoil® heating process® (from www.indiumcorp.com)

Figure 1. Illustration of the NanoBond® / NanoFoil® heating process® (from www.indiumcorp.com)

S-Bond active solder layers have been shown in many applications to be the key ingredient that permits many ceramics and refractory metals to be bonded to largely coefficient of thermal expansion (CTE) mismatched metals such as aluminum and copper. Indium Corporation offers a NanoBond® process that uses NanoFoil ® as local heat source to remelt preplaced solder layers without the need for the bulk heating of assembled components that have large CTE mismatch. Active S-Bond solders are applied as prelayers and have Ti, Ce, Ga and Mg additions that permit them to wet any ceramic or metal surface. Once the S-Bond pre-layers are applied to ceramic and/or metallic surfaces, conventional solders can be reflowed onto the S-Bond layer to create the preplaced solder layers that are remelted and bonded via the heat emitted from an ignited NanoFoil®. Figure 1 illustrates how temperatures of over 1,400 K are generated by an ignited nano-engineered foil. Read more about S-Bond® Solders At the Interface of the NanoBond® Process

S-Bond Develops Fluxless “Hybrid” Soldering Techniques

Hybrid S-Bond joining processes eliminate the use of fluxes and have been shown to be more effective since it completely joins with the S-Bond filler metals. The methods that are recommended to minimize the use of S-Bond, yet still achieve fluxless joining are as follows: Read more about S-Bond Develops Fluxless “Hybrid” Soldering Techniques