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S-BOND BLOG

Metal Soldering with Active Solders

Active solders such as S-Bond have wide application in joining a wide variety of metals including aluminum, copper, stainless steel, titanium, all based on S-Bond alloys’ ability to directly wet and adhere to the metallic surface compounds. Using mechanical activation active solders such as S-Bond successfully join like and dissimilar metal combinations in a wide variety of applications, from heat sinks and sensors to medical/surgical devices. (more…)