S-Bond to Sell EWI’s Lead-free, Fluxless Solder

S-Bond Technologies and EWI have signed an agreement granting S-Bond Technologies the ability to distribute EWI’s patented lead-free, fluxless solder marketed by EWI as EWI SonicSolder®. The agreement is effective immediately. SonicSolder® is an active solder that permits the cost effective fluxless joining of aluminum, copper, other metals, glass, and ceramics without the need for plating. Read more about S-Bond to Sell EWI’s Lead-free, Fluxless Solder