Epoxy Bond vs. Solder Bond Applications

Bond assembly can be done via 1) mechanical attachment, 2) adhesive bonding of which epoxy bonding is one form of adhesive, 3) soldering bonding using lower melting filler metals (< 450˚C), 4) brazing using filler metals melting above 450˚C, and 5) welding such as resistance welding bonding, ultrasonic welding and friction weld bonding that uses locally melted parent metal.

Bonding is done for a variety of technical reasons a) mechanical attachment, b) thermal contact, c) electrical contact d) gas or liquid seal, or e) any or all combinations thereof. The choice of bonding method will then depend on the intrinsic properties of the bonding filler materials ( i.e. hermetic, electrical conductance, thermal conductance, thermal coefficient of expansion, adhesive bond strength related to the intrinsic fillers’ mechanical properties, and their adhesive and cohesive strengths). Read more about Epoxy Bond vs. Solder Bond Applications

Solder Bond vs. Epoxy Bond as Thermal Interface Materials (TIM)

Thermal interface materials are materials used in creating heat conductive paths at interfaces between components and thus reduce thermal interface resistance. These materials permit more effective heat flow between separate components where heat is being generated to a heat dissipation components such as solid state transistors to heat sink or a high frequency device connected to a heat spreader. Thermal interface materials’ purpose is to fill the air gap that occurs at contact interfaces with more thermally conductive compounds to permit more effective heat flow than poorly conductive air.

There is a wide variety of thermal interface materials (TIM’s); thermal greases, phase change polymers, thermal tapes, gap filling pads, filled epoxies and solders. All having various costs, performance and manufacturing challenges.

sbondblog1 150x150 Solder Bond vs. Epoxy Bond as Thermal Interface Materials (TIM)

Figure 1. Illustration of thermal grease filling an interface
between a heat generating device and a heat sink.

Thermal greases are viscous fluid substance which increase the thermal conductivity of a thermal interface “gap by filling microscopic air-gaps present due to the imperfectly flat and smooth surfaces of the components as seen in Figure 1.

Thermal grease compounds have far greater thermal conductivity than air (but far less than metals). They are used in electronics, as depicted in Figure 2, to improve the heat flow from lower power electronic devices thus lowering the components temperature and increasing its life.

Read more about Solder Bond vs. Epoxy Bond as Thermal Interface Materials (TIM)