http://www.s-bond.com/blog Just another WordPress weblog Fri, 27 Jan 2012 19:38:24 +0000 en hourly 1 http://wordpress.org/?v=3.3.1 http://www.s-bond.com/blog/2010/05/18/what-is-s-bond%c2%ae-220/ http://www.s-bond.com/blog/2010/05/18/what-is-s-bond%c2%ae-220/#comments Tue, 18 May 2010 16:59:38 +0000 sbondadmin http://www.s-bond.com/blog/?p=176 S-Bond 220 is a solder material (Sn-Ti-Ag) and a process by which most materials, including dissimilar metallic and ceramic materials can be joined. It is a new family of solders, developed and patented by S-Bond Technologies. The material is an activated solder with elements added to the alloy that react with surfaces during joining and adhere to any surface films that normally disrupt wetting and bonding. The characteristics of S-Bond 220 include:
- Joining Temperature(s):
250 – 270oC (480 – 580 oF)
- Tensile Strengths:
>28-100 MPa (4,100 – 7,000 psi)

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