Ultrasonic Soldering & Active Solders

S-Bond® active solders are very effective in combination with ultrasonic soldering for a range of applications. Ultrasonic soldering (U/S) is a fluxless soldering process and is finding growing application in soldering of metals and ceramics from solar photovoltaics and medical shape memory alloys to specialized electronic and senor packages. U/S soldering has been reported since 1955 as a method to solder aluminum and other metals without the use of flux. The reason for expanding usage is that ultrasonic soldering is a fluxless process. Read more about Ultrasonic Soldering & Active Solders

Mechanical Activation of Active Solders

Mechanical vs Chemical Fluxing During Solder Bonding

Flux is derived from Latin word fluxus meaning “flow.” In solder joining (also  aluminum soldering, graphite bonding, ceramic to metal brazing, etc.), a flux facilitates wetting by molten metals disrupting oxides on metal surfaces which interrupt the reaction/interaction of the molten solder metals with the underlying metal. Additionally, flux allows solder to flow easily on the working piece rather than forming beads as it would otherwise. Read more about Mechanical Activation of Active Solders