http://www.s-bond.com/blog Just another WordPress weblog Tue, 18 May 2010 17:16:56 +0000 http://wordpress.org/?v=2.8.4 en hourly 1 http://www.s-bond.com/blog/2010/05/18/s-bond-develops-fluxless-%e2%80%9chybrid%e2%80%9d-soldering-techniques/ http://www.s-bond.com/blog/2010/05/18/s-bond-develops-fluxless-%e2%80%9chybrid%e2%80%9d-soldering-techniques/#comments Tue, 18 May 2010 17:15:11 +0000 sbondadmin http://www.s-bond.com/blog/?p=191 Hybrid S-Bond joining processes eliminate the use of fluxes and have been shown to be more effective since it completely joins with the S-Bond filler metals. The methods that are recommended to minimize the use of S-Bond, yet still achieve fluxless joining are as follows:

• Heat base materials to S-Bond melting temperature.
• Melt a small amount of S-Bond onto the joining surfaces.
• Add ~ 0.1g/cm2 to the opposing surfaces to be joined
• Add S-Bond to the opposing joint surface.
• Mechanically spread the S-Bond layer to completely cover the joint area (brush, spatula or ultrasonics).
• Melt “conventional” solders onto the S-Bond layer on the bottom base and agitate to assure wetting to the underlying S-Bond layer.
  NOTE: Sn-Ag, Pb-Sn, Sn-Bi, In solders can be used
• Add enough “conventional” solder to the base to “float” and slide the top surface of the joint onto the conventional solder and provide excess solder to fill any gaps.NOTE: The sliding of the molten S-Bond / solder surfaces onto one another eliminates entrapped air and mechanically shears the surfaces of the S-Bond layer to the bottom “conventional “ solder layer on the base.

]]> http://www.s-bond.com/blog/2010/05/18/s-bond-develops-fluxless-%e2%80%9chybrid%e2%80%9d-soldering-techniques/feed/ 0 http://www.s-bond.com/blog/2009/07/12/s-bond-active-solder-bonding/ http://www.s-bond.com/blog/2009/07/12/s-bond-active-solder-bonding/#comments Sun, 12 Jul 2009 21:56:37 +0000 sbondadmin http://newsite.s-bond.com/blog/?p=82 S-Bond was developed between 1995 – 2005 during which the materials and process technology has progressed to encompass the joining of most metals, semiconductors, ceramics and many composites of metals/ceramics. Key to the success of S-Bond active solders are they contain combinations of active metals such as titanium with rare earths such as cerium. These very active solders permit fluxless joining and eliminates the need for Ni or Cu plating before solder joining. SBT has also developed methods to actively solder bond and hermetically seal ceramics such as Al2O3, sapphire, quartz and zirconia. Please review our website, www.s-bond.com and take a look at our brochure and technical literature on the site. We would appreciate if you would share this blog and our website with your colleagues and customers, as S-Bond is an excellent solution for many dissimilar materials bonding applications.

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