S-Bond Technologies “Industry News” Webpage

S-Bond Technologies has added a News section to its website. This news section is focused on industry and technology developments that may be of general interest to you or may impact your business. Our Industry News feed will be updated during each month as targeted technology and industry news is identified.  Dr. Ronald Smith, President of S-Bond Technologies says “Our Company is materials technology focused with solutions in metals and ceramic bonding that are well suited for dissimilar materials joining, aluminum bonding, and ceramic to metal bonding. Applications for our technology include thermal management, alternative energy, sensors, electronics, aerospace and automotive. We are providing this Industry News section focused on applications that benefit from bonding technology as a feature for our website visitors and customers.”

This industry news provided at our website www.s-bond.com centers on materials technology in industry where bonding/soldering/brazing challenges are prevalent. The News section articles will be available in an S-Bond News Team periodic email that will feature the most recent news articles.

Please if you want to opt-in on our periodic S-Bond News Team communication… please click the link below. If you do not opt-in, you can still see the news by visiting our website, www.s-bond.com . If you do not opt-in, you will remain on our S-Bond e-Newsletter that features S-Bond related technical articles.

Opt-In for the S-Bond News Team communication.

S-Bond Develops Fluxless “Hybrid” Soldering Techniques

Hybrid S-Bond joining processes eliminate the use of fluxes and have been shown to be more effective since it completely joins with the S-Bond filler metals. The methods that are recommended to minimize the use of S-Bond, yet still achieve fluxless joining are as follows: Read more about S-Bond Develops Fluxless “Hybrid” Soldering Techniques

S-Bond to Sell EWI’s Lead-free, Fluxless Solder

S-Bond Technologies and EWI have signed an agreement granting S-Bond Technologies the ability to distribute EWI’s patented lead-free, fluxless solder marketed by EWI as EWI SonicSolder®. The agreement is effective immediately. SonicSolder® is an active solder that permits the cost effective fluxless joining of aluminum, copper, other metals, glass, and ceramics without the need for plating. Read more about S-Bond to Sell EWI’s Lead-free, Fluxless Solder

Welcome to the new S-Bond blog!

We are pleased to introduce our Blog as part of our commitment to communicate effectively with our customers, our prospective customers and anyone interested in our S-Bond, active solder bonding technology. This blog will feature news, technical updates, application updates, and general discussions about bonding and assembly of components.

We look forward to you visting our website and participating in the blog. As the blog develops interest, we hope to have good discussions about the active solder joining and related bonding technology and applications. Feel free to comment in our blog space.

S-Bond Active Solder Bonding

S-Bond was developed between 1995 – 2005 during which the materials and process technology has progressed to encompass the joining of most metals, semiconductors, ceramics and many composites of metals/ceramics. Key to the success of S-Bond active solders are they contain combinations of active metals such as titanium with rare earths such as cerium. These very active solders permit fluxless joining and eliminates the need for Ni or Cu plating before solder joining. SBT has also developed methods to actively solder bond and hermetically seal ceramics such as Al2O3, sapphire, quartz and zirconia. Please review our website, www.s-bond.com and take a look at our brochure and technical literature on the site. We would appreciate if you would share this blog and our website with your colleagues and customers, as S-Bond is an excellent solution for many dissimilar materials bonding applications. Read more about S-Bond Active Solder Bonding