Many times our customers have to coat assemblies operations after aluminum bonding, graphite bonding, ceramic to metal bonding, etc; this can present certain challenges that one should be aware of since soldered joints. Unlike welded and many brazed joints, soldered joints utilize a significantly different filler metal. In the case of S-Bond solders, Sn-Ag is the common base filler that is used in aluminum bonding as well as copper, steel, stainless steel, refractory metals, and titanium and many other metals. As such, then the properties of the joint MUST be considered when coating. Read more about Can S-Bond Soldered Joints be Coated ?
S-Bond® active solder enables the joining of sapphire to metals and provides an alternative to other sealing processes. S-Bond joining of sapphire/metal seals is proving to be a more robust and reworkable joining process while being simpler than many of the existing sapphire widow sealing processes, as this article presents. Read more about Sapphire Window Sealing with S-Bond®
S-Bond® active solders enable graphite bonding and the joining of other carbon or carbide based materials to each other and to most metals within the constraints of thermal expansion mismatch. S-Bond alloys have active elements such as titanium and cerium added to Sn-Ag, Sn-In-Ag, and Sn-Bi alloys to create a solder that can be reacted directly with the carbon surfaces prior to bonding using specialized S-Bond treatments prior to solder joining. Reliable joints have been made between graphite and carbon based materials with all metals including steel, stainless steels, titanium, nickel alloys, copper and aluminum alloys… Read more about Graphite / Carbon Joined to Metals with S-Bond®
Active solder, S-Bond® alloys have been developed to bond to a range of metals, ceramics and composite materials without the need for fluxes of preplating. In particular, such active solder alloys have an affinity for joining aluminum to itself and other metals and ceramics. Aluminum soldering has gotten simpler with the emergence of such S-Bond® solders. Just melt the S-Bond filler metals, mechanically spread them on the surface via brushing, rubbing, or via ultrasonically activated spreaders and the alloys will wet, adhere and provide a base for bonding. In a subsequent step, when two molten pre-tinned S-Bond layers are pressed or slid together the S-Bond layers will activate a strong solder bond. Read more about Aluminum Bonding with Active Solders