Mechanical Activation of Active Solders

Mechanical vs Chemical Fluxing During Solder Bonding

Flux is derived from Latin word fluxus meaning “flow.” In solder joining (also  aluminum soldering, graphite bonding, ceramic to metal brazing, etc.), a flux facilitates wetting by molten metals disrupting oxides on metal surfaces which interrupt the reaction/interaction of the molten solder metals with the underlying metal. Additionally, flux allows solder to flow easily on the working piece rather than forming beads as it would otherwise. Read more about Mechanical Activation of Active Solders

Joining Dissimilar Materials

The Issue of Coefficient of Thermal Expansion (CTE) Mismatch

Yes, S-Bond can join a wide variety of materials, including aluminum, copper, stainless steel, refractory metals and ceramic to metal brazing with aluminum oxide, aluminum nitride, silicon carbide and other oxide, nitrides and carbides… however, with this wide variety of materials joining capability, we have a lot of inquiries about aluminum soldering to stainless steel or aluminum oxide, graphite bonding to aluminum, titanium to silicon carbide, etc. Read more about Joining Dissimilar Materials

Ceramic to Metal Bonding

S-Bond® active solders enable ceramic to metal bonding and sapphire to metal bonding as well as to each other. S-Bond alloys have active elements such as titanium and cerium added to Sn-Ag, Sn-In-Ag, and Sn-Bi alloys to create a solder that can be reacted directly with the ceramic and sapphire surfaces prior to bonding. S-Bond alloys produce reliable, hermetic joints with all metals…including steel, stainless steels, titanium, nickel alloys, copper and aluminum alloys. Read more about Ceramic to Metal Bonding