Sputter Targets

S-Bond® active solders enable the joining of dissimilar metals and ceramics to each other and to other metals. S-Bond’s patented alloys have active elements such as titanium and cerium added to Sn-Ag, Sn-In-Ag, and Sn-Bi alloys to create a solder that can be reacted directly with the metallic and/or ceramic surfaces prior to bonding. S-Bond filler metal alloys produce reliable joints with copper, aluminum, steel, stainless steels, titanium, chromium, nickel alloys, refractory metal alloys and many ceramics including alumina, zirconia, AlN, SiC and joins to most semiconductors including Si, GaAs, CIGS, etc.

S-Bond joins… 

• Directly, without the use of flux.
• Without pre-plating steps, eliminating multiple-step coating processes.
• At temperatures below 400ºC, preventing the distortion and softening of metals and also preventing ceramic fractures.

The joints produced by S-Bond active solders are:

• Strong (> 5,000 psi shear).
• Ductile, based on Sn-Ag or Sn-In alloys.
• Capable of service temperatures up to 190ºC.

S-Bond® active solder joining eliminates the need for flux and preplating while offering the capability to directly bond to ceramic and semiconductor materials. S-Bond® simplifies the joining of many of the typical sputter target geometries. The joining materials are Pb-free and their temperature capabilities exceed that of Indium. For example, S-Bond 220 and 220M joined sputter targets interfaces have shear strengths of 3 – 5,000 psi (20-32 MPa) and can be taken to 195ºC without significant lowering of the room temperature values.

S-Bond Materials for Sputter Target Joining

S-Bond Alloy          T_m (ºC)          T_service          Joint Strength
                                                                               (to copper, psi)
115 (In-Sn-Ag)       120                100                2 – 3,000
130 (In-Sn-Ag)       135                120                2-3,000
140 (Sn-Bi-Ag)       150                135                3-4,000
220 (Sn-Ag)           235                195                5-6,000
220M (Sn-Ag)        235                195                5-6,000

Note: SBT 220M is formulated for joining semiconductors and silicon based compounds and has been found to be excellent for bonding to refractory metals, such as Mo, W, and Ta.
 

Target materials that can be joined with S-Bond® filler metals to copper and other backing metals include…

Metals

• Gold
• Silver
• Nickel
• Vanadium
• Antimony
• Tellurium
• Germanium
• Aluminum
• Titanium
• Copper
• Tantalum
• Cobalt
• Iron
• Chromium
• Manganese
• Stainless steel
• Molybdenum
• Tungsten

Semiconductors / Compounds / Ceramics

• Silicon
• Gallium Arsenide
• Zinc Sulfide
• Silicon Dioxide
• Indium Tin Oxide (ITO)
• Al – Zinc Oxide (AZO),
• Indium Zinc Gallium Oxide
• Aluminum Oxide & Zirconium Oxides
• Most other Metal Oxides
• Titanium Carbide & Silicon Carbide
• Copper Indium Gallium (Di)Selenide (CIGS)
• Cadmium Telluride

Contact Us for a demonstration of S-Bond’s unique capability to meet many of your sputter target joining requirements.