Housings, Windows & Feedthroughs
S-Bond active solders are hermetic and can effectively join dissimilar metals, ceramics, and glass that are used on enclosures, housings and feedthroughs used to contain and protect sensors. They permit signal, power or optical signals to pass into a vessel. Examples of components that SBT produces are shown below.
The figures to the left shows several types of housings. The top figure shows solder joined stainless steel housings that protect ultrasonic, piezo-electric elements. The middle figure shows optical sensor housings that contain and protect detector crystals. The housing consists of sapphire windows and thin-walled titanium tubes that are S-Bond joined at 250ºC, which lowers distortion and produces a more robust seal than conventional metallization based or active brazed seals. S-Bond’s lower joining temperatures and more compliant solder interface makes the joint more stable.
S-Bond can also join a variety of sensor/optical windows as seen in the bottom figure where quartz or sapphire is joined to Kovar® or other metallic frame materials.
S-Bond can also join a wide range of UV and IR inorganic crystal windows, such as ZnSe, BaF2 and LiF. Such window assemblies are normally brazed or conventionally soldered after a metallization is first placed on the edge of the window and the metallic housing. These metallization processes are either vacuum vapor deposited or are sintered, using a Mo-Mn deposition followed by a Ni-plating to produce an adherent metallic layer that solders or braze filler metals can adhere to. S-Bond, in one step, can metallize and later join the ceramic lenses to the metallic frames or enclosures at temperatures lower than brazing, thus minimizing distortion. This is especially useful when making larger sensor housings and windows.
Contact Us about your application and let us engineer an S-Bond solution for you
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