Electronic Packages

Electronic Packages
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Electronic packages utilize a wide range of materials designed for a variety of functions to include heat sink lids, hermetic seals and EMI shielding. Ceramics, various metals and even composite materials are being used to engineer a specific package to its requirements and to suit operating environments. S-Bond is a versatile joining material that can join from 115 - 400C, depending on the service requirements.
 
The increased use of new materials for improved thermal management at a lower cost is challenging conventional joining processes. SBT products bond to silicon dies and MEMS without the need to coat or metallize prior to joining. These materials also join well to copper-tungsten, alumina, silicon carbide, nickel, and other materials used in lids and substrates.
 
These capabilities offer the possibility for direct die attachment to a package lid, joining of MEMS and other devices into lead frames, and direct attachment of silicon or silicon carbide devices to heat sinks and heat spreaders.
 
Additionally, in the area of power electronics, S-Bond® materials can be used to bond IGBT modules directly to base plates of copper-tungsten, aluminum silicon carbide, aluminum nitride, and nickel coated versions of these materials.

Fluxless soldering is preferred since flux may contaminate the electronics or optics in a package. S-Bond is well suited to join such packages as shown in the figures to the left. S-Bond can join the optical fibers and/or windows as well as bond the metallic components together. 
 
High performance microprocessors need innovative ideas for thermal management if they are to continue to increase in speed. One option is to improve TIM1 performance through the use of direct die attachment using solder materials. 
 
Conventional attachment techniques using filled polymers can't offer the same level of thermal conductivity as a completely metal bond, but directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces.

SBT offers options for bonding to silicon, metal, ceramic, or ceramic composite materials without metallization or flux, which can withstand lead free solder reflow cycles for board mounting.
 
Contact Us to assess the suitability of S-Bond joining of your electronic or opto-electronic packages. 
 
 
IGBT-High Piower Modules

The increased use of new materials for improved thermal management and lower cost is challenging conventional joining processes. SBT products have been shown to bond to silicon dies and MEMS without the need to coat or metallize prior to joining. These materials also join well to copper-tungsten, alumina, silicon carbide, nickel, and other materials used in lids and substrates.

Thermal Management

These capabilities offer the possibility for direct die attachment to a package lid, joining of MEMS and other devices into lead frames, and direct attachment of silicon or silicon carbide devices to heat sinks and heat spreaders.

Additionally, in the area of power electronics, S-Bond® materials can be used to bond IGBT modules directly to base plates of copper-tungsten, aluminum silicon carbide, aluminum nitride, and nickel coated versions of these materials.

High Power Modules
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Many times fluxes may contaminate the electronics or optics in a package therefore fluxless soldering is preferred. S-Bond is well suited to join various packages as show in the figure to the left. S-Bond can join the optical fibers and/or windows as well as bond the metallic components together.

Contact Us for your electronic packaging needs and let us assess the suitability of S-Bond joining of your electronic or opto-electronic packages.

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