Aluminum Bonding
S-Bond® can be an alternative bonding process to welding or brazing where low temperature joining is required and the service or stress service environment would permit a soldered joint. S-Bond is very effective in soldering aluminum to aluminum as well as soldering aluminum to copper. In some cases, can replace controlled atmosphere brazing or “dip brazing” .
Active S-Bond® solders react with and break through the oxide layers on aluminum and also with copper to react quickly and bond with the metal without the use of plating or fluxes, thus lowering the process cost of soldering aluminum or aluminum-copper components and also eliminating aggressive chemicals that create environmental hazards. Additionally, S-Bond’s low joining process temperature (typically below 250ºC) preserves the hardness and strength of the base aluminum making the finished component more robust.
Advantages of S-Bond Joining of Aluminum
- Lower temperature bonding (from 120 – 250°C) lowers thermal expansion mismatch issues.
- Permits the joining of aluminum to copper and other metals and ceramics, provided thermal expansion mismatch is managed in the component design.
- An S-Bond ( solder) metallic joint provide thermally conductive bonded interfaces
- No additional metal plating is required to prepare aluminum surfaces is needed, lowering preparation costs.
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