EWI SonicSolder
S-Bond has been licensed as a supplier and provider of ultrasonic activated joining services using EWI SonicSolder®, an EWI patented* binary lead-free solder alloy that melts at 231°C. In conjunction with ultrasonic soldering, it can be used to join difficult-to-wet materials like aluminum, titanium, glass, ceramics and dissimilar materials. Potential applications include tubing, electronics, medical products and structural components. In various base metal (copper, aluminum, titanium) combinations, shear strength of about 5 ksi have been obtained.
SonicSolder is another active solder composition that supplements S-Bond Technologies’’ bonding solutions. In combination with ultrasonic activation, SonicSolder, with no titanium and silver, can reduce the cost of active solder joining compared to other solders.
SonicSolder features include:
- Fluxless joining
- Patented composition with aluminum additions make the solder active
- No silver, thus lowers cost alloy than many lead free solders
- Requires ultrasonic agitation to adhere to surfaces
- Bonds to all metals, glass and ceramics
EWI SonicSolder® is of interest in the medical industry due to its bio-compatibility. The lack of silver in its composition also makes it highly attractive for lead-free soldering in electronics applications.
Download a SonicSolder brief or read more about Ultrasonic Soldering with SonicSolder.
Contact us for information on materials, test kits, and ultrasonic application tools.
See http://www.ewi.org/products/sonicsolder.asp for additional information and updates on EWI SonicSolder® technology.
* EWI SonicSolder® is patented under U.S. Patent No. 6,659,329 and licensed by S-Bond Technologies from EWI Joining Technology Center.
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