Bonding Development

Alloys

A set of S-Bond, active solders are in regular production and are designed to join over a range of temperatures and for a range of base materials. S-Bond alloys all have the common active elements of Ti, Ce, and/or Ga, which in combination with many common solders bases such as Sn-Ag, Sn-In, Sn-Bi and Pb-Sn, create active solders than can, without the use of flux, join many metals, ceramics, composites and glass.

S-Bond Technologies currently has nine (9) active solder compositions that are being used in various applications. Some, in the table below, have recently been developed and are only available in experimental quantities. S-Bond 220, 220-50, 220M and 400 are our regular production alloys. Our development staff stands by to develop new compositions to meet our customers’ applications requirements. 

Processes

S-Bond joining requires mechanical agitation to enable the S-Bond alloys to wet and adhere to the surfaces of the materials being joined. As described in other sections, mechanical agitation consists of methods such as brushing, rubbing, or ultrasonics. Once the two surfaces are wetted, joining is achieved by using mechanical agitation to include sliding, oscillating and/or rotating.

SBT has recently been developing methods to join metal conductor strips directly to solar panel surfaces. These conductors collect the photovoltaic (PV) currents created by the impinging solar energy. S-Bond alloys have been developed that directly bond to silicon and other PV materials such as CIGS. Processes using thermo-sonic bonding methods are being developed that will cost effectively be able to directly bond the conductors without the use of flux or plating.

Components

Solar Panels

SBT has recently been developing methods to join metal conductor strips directly to solar panel surfaces. These conductors collect the photovoltaic (PV) currents created by the impinging solar energy. S-Bond alloys have been developed that directly bond to silicon and other PV materials such as CIGS. Processes using thermo-sonic bonding methods are being developed that will cost effectively be able to directly bond the conductors without the use of flux or plating.

Glass / Metal

S-Bond alloys have been developed that permit the bonding of metals to various glasses.

Ultrasonic Assisted Stud Bonding

The rapid joining of anchor points onto metallic, ceramic and glass joining is a recent area of development that relies on SBT’s bonding expertise in combination with development partners that have expertise in ultrasonic metal welding. By employing an innovative combination of heat, vibration, S-Bond filler and pressure, the rapid joining of metallic studs to metal, ceramic and/or glass surfaces is possible. Examples of applications that would use such studs are large flat aluminum panels for solar collector panels, glass plates for doors mounting hardware, medical devices, etc…

These and many other developments are continually being investigated in SBT’s Development Laboratory. Contact Us so we can assist you with your ideas and developments.