Bond Testing
SBT offers a range of bond testing for its customers.
Non-destructive testing of bonded interfaces is conducted using our high resolution, C-SAM ultrasonic imaging equipment.
It can image up to 1200 x 600 mm size flat interfaces to non-destructively determine the level of bonding (% bond) over large flat areas.
This test capability is an excellent process development tool as well as a production inspection capability.
SBT also offers helium leak detection services to fully verify the hermeticity of leak critical joints.
A Varian Model 959 Helium leak detector provides leak integrity measurements to a sensitivity of 1 x 10-9 mmH - l/sec. We can provide such services in development, prototype or production stages.
Through our network of local service suppliers, we can offer a full range of mechanical testing and metallographic destructive testing. These services are invaluable in the development of joining processes under development.
Contact Us for any bond testing and joint integrity testing that you would require for your components.
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