Ceramic Metal Bonding

Sapphire to Titanium Hermetically Sealed Sensor Window

S-Bond® active solders enable the joining of ceramics (oxides, nitrides, carbides, carbon/graphite silicides, etc…) to metals. S-Bond alloys have active elements such as titanium and cerium added to Sn-Ag, Sn-In-Ag, and Sn-Bi alloys to create a solder that can be reacted directly with the ceramic and sapphire surfaces prior to bonding. S-Bond alloys produce reliable, hermetic joints with all metals…including steel, stainless steels, titanium, nickel alloys, copper and aluminum alloys, provided thermal expansion mismatch a the joining temperatures are managed.

Advantages of S-Bond® Ceramic/Metal bonding

• Lowers joining temperatures compared to conventional active brazing.
• Permits larger and more complex assemblies to be fabricated without ceramic cracking.
• Does not require plating of sapphire or the metal in the assemblies.
• Increases process yields related to joint failures from poor metallization layers.
• Lowers joining costs with reduced steps
• Eliminates clean-up of flux residue
• Produces a reworkable joint that can be taken apart and reliably joined again