S-Bond Solder Alloys
Our materials are alloys of conventional solder formulations that wet and bond without the use of flux or preplating. All formulations are lead and cadmium free and conform to the requirements of all lead free solder initiatives (RoHS, etc.). Formulations are available in ingot, wire, foil, pellet, and custom preforms. Please Contact Customer Service for lead times for specific forms of a product as well as current pricing. A list of our currently available alloys is shown below. For more information on our materials (data, MSDS, etc.) and applications please refer to our Literature section of this site.
S-Bond Alloys & Joining Temps (º C)
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S-Bond® Alloys
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Joining Temp (º C)
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S-Bond 115 (In-Sn) **
Low temperature for sensitive materials
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125-130oC
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S-Bond 130 (Sn-In)
Low temperature for electronics
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140—150oC
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S-Bond 140 (Sn-Bi) **
Low temperature for ceramics-metals
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150—160oC
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S-Bond 190(Pb-Sn) **
For hierarchical joining
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200- 210oC
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S-Bond 200 (Sn-Zn) **
For Pb and Ag free joining, offering lower temperatures that SB-220
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200—220oC
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S-Bond 220 (Sn-Ag)
Most versatile Pb free joining
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240—260oC
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S-Bond 220-50 (Sn-Ag)
For joining Al and copper
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240—260oC
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S-Bond 220M (Sn-Ag)
For joining glass, ceramics
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240—260oC
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S-Bond 400 (Zn-Al-Ag)
Highest temperature active solder
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420—430oC
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** NOTE: these alloys are development alloys and are available in limited quantities and forms.
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