Electronic Packaging

The increased use of new materials for improved thermal management at a lower cost is challenging conventional joining processes. SBT products have been shown to bond to silicon dies and MEMS without the need to coat or metallize prior to joining. These materials also join well to copper-tungsten, alumina, silicon carbide, nickel, and other materials used in lids and substrates.

These capabilities offer the possibility for direct die attachment to a package lid, joining of MEMS and other devices into lead frames, and direct attachment of silicon or silicon carbide devices to heat sinks and heat spreaders.

Additionally, in the area of power electronics, S-Bond® materials can be used to bond IGBT modules directly to base plates of copper-tungsten, aluminum silicon carbide, aluminum nitride, and nickel coated versions of these materials.

Fluxless soldering is preferred since flux may contaminate the electronics or optics in a package. S-Bond is well suited to join such packages as pictured. S-Bond can join the optical fibers and/or windows as well as bond the metallic components together. 

High performance microprocessors need innovative ideas for thermal management if they are to continue to increase in speed. One option is to improve TIM1 performance through the use of direct die attachment using solder materials. 

Conventional attachment techniques using filled polymers can't offer the same level of thermal conductivity as a solder (metal) bond, but direct conventionally soldering to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces.

SBT offers options for solder bonding to silicon, metal, ceramic, or ceramic composite materials without metallization or flux, which can withstand lead free solder reflow cycles for board mounting.

Contact Us  to assess the suitability of S-Bond joining of your electronic or opto-electronic packages.